As of: 2026-10-14 00:22 CEST.
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# Andreas Schilling: Maia 300 chiplet configuration

Andreas Schilling 🇺🇦 (@aschilling), X, 2026-10-12.
Source: https://x.com/aschilling/status/2109633438672458119

## Why it matters

Compact list of the package layout as presented by Microsoft.

## Summary

Posted Oct 12, 2026 (13:13 UTC). Andreas Schilling (@aschilling) lists the Maia 300 chiplet configuration: one main compute die (TSMC N2P), two I/O dies, four memory dies, eight HBM4 stacks (288 GB), TDP 950 W.

_Metrics as of 2026-10-13 via api.fxtwitter.com: 11,581 views, 185 likes, 19 reposts. Author: about 17,531 followers._

## Archived text

> Microsoft Maia 300 chiplet configuration:
> 
> - 1x Main Compute Die (TSMC N2P)
> - 2x I/O Die
> - 4x Memory Die
> - 8x HBM4 Stacks (288 GB)
> - TDP: 950 W

Archived 2026-10-13 via fxtwitter (unofficial).
Counts: 11,586 views, 185 likes, 19 reposts, 4 replies (at fetch time)
Media: https://pbs.twimg.com/media/HUbr57uXMAALn3t.jpg?name=orig

## Cited in

- 2026-10-12: [Microsoft announces Maia 300, its third in-house AI chip, and plans multi-gigawatt Maia deployments from 2027](https://postcutoff.com/e/2026-10-12-microsoft-maia-300/)