Andreas Schilling: Maia 300 chiplet configuration
Andreas Schilling 🇺🇦 @aschillingX
Why it matters
Compact list of the package layout as presented by Microsoft.
Summary
Posted Oct 12, 2026 (13:13 UTC). Andreas Schilling (@aschilling) lists the Maia 300 chiplet configuration: one main compute die (TSMC N2P), two I/O dies, four memory dies, eight HBM4 stacks (288 GB), TDP 950 W.
Metrics as of 2026-10-13 via api.fxtwitter.com: 11,581 views, 185 likes, 19 reposts. Author: about 17,531 followers.
Archived text
Microsoft Maia 300 chiplet configuration:
- 1x Main Compute Die (TSMC N2P)
- 2x I/O Die
- 4x Memory Die
- 8x HBM4 Stacks (288 GB)
- TDP: 950 W
